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| IEC/TC 113 | NORMALISATION DANS LE DOMAINE DES NANOTECHNOLOGIES RELATIVES AUX APPAREILS ET SYSTÈMES ÉLECTRIQUES ET ÉLECTRONIQUES |
| CLC/SR 113 | NORMALISATION DES NANOTECHNOLOGIES RELATIVES AUX APPAREILS ET SYSTÈMES ÉLECTRIQUES ET ÉLECTRONIQUES |
| IEC/TC 113/JPT 62607-6-3 | NANOFABRICATION - CARACTÉRISTIQUES DE CONTRÔLE CLÉ ¿ PARTIE 6-3: GRAPHÈNE - EVALUATION DU NIVEAU DE DÉFAUT DANS LA COUCHE DE GRAPHÈNE |
| IEC/TC 113/PT 62607-6-2 | NANOFABRICATION - CARACTÉRISTIQUES DE CONTRÔLE CLÉ ¿ PARTIE 6-2: GRAPHÈNE ¿ EVALUATION DU NOMBRE DE COUCHES DE GRAPHÈNE |
| IEC/TC 113/PT 62607-6-1 | NANOFABRICATION - CARACTÉRISTIQUES DE CONTRÔLE CLÉ ¿ PARTIE 6-1: GRAPHÈNE ¿ CARACTÉRISATION ÉLECTRIQUE |
| IEC/TC 113/MT 62607-4 | NANOFABRICATION - CARACTÉRISTIQUES DE CONTRÔLE CLÉ ¿ PARTIE 4-1 : STOCKAGE DE L¿ÉNERGIE ÉLECTRIQUE PERMIS PAR LES NANOTECHNOLOGIES |
| IEC/TC 113/WG 7 | FIABILITÉ |
| IEC/TC 113/WG 3 | EVALUATION DE LA PERFORMANCE |
| IEC/TC 113/AG 4 | CHAIRMAN ADVISORY GROUP |
| IEC/TC 113/JWG 2 | MEASUREMENT AND CHARACTERIZATION |
| IEC/TC 113/JPT 62565-3-1 | NANOMANUFACTURING - MATERIAL SPECIFICATIONS - PART 3-1: GRAPHENE - BLANK DETAIL SPECIFICATION |
| IEC/TC 113/JWG 1 | TERMINOLOGY AND NOMENCLATURE |
| IEC/TC 113/PT 62607-2-4 | NANOMANUFACTURING - KEY CONTROL CHARACTERISTICS - PART 2-4: CARBON NANOTUBE MATERIALS ' ACCURACY AND REPEATABILITY OF TEST METHODS FOR DETERMINATION OF RESISTANCE OF CARBON NANOTUBES |
| IEC/TC 113/PT 80004-12 | ISO TS 80004-12 NANOTECHNOLOGIES - VOCABULARY - PART 12: QUANTUM PHENOMENA IN |
| IEC/TC 113/PT 62607-3-3 | NANOMANUFACTURING - KEY CONTROL CHARACTERISTICS - LUMINESCENT NANOMATERIALS - DETERMINATION OF FLUORESCENCE LIFETIME |
| IEC/TC 113/PT 62607-5-2 | NANOMANUFACTURING - KEY CONTROL CHARACTERISTICS - PART 5-2: THIN-FILM ORGANIC/NANO ELECTRONIC DEVICES - MEASURING ALTERNATING CURRENT CHARACTERISTICS |
| IEC/TC 113/MT 62632 | NANOSCALE ELECTRICAL CONTACTS AND INTERCONNECTS |
| IEC/TC 113/PT 62607-5-3 | NANOMANUFACTURING ' KEY CONTROL CHARACTERISTICS - PART 5-3: THIN-FILM ORGANIC/NANO ELECTRONIC DEVICES ' MEASUREMENTS OF CHARGE CARRIER CONCENTRATION |
| IEC/TC 113/PT 62876-3-1 | NANOMANUFACTURINRELIABILITY ASSESSMENT - PART 3.1: GRAPHENE - STABILITY TEST: TEMPERATURE AND HUMIDITY |
| IEC/TC 113/PT 62607-6-6 | NANOMANUFACTURING - KEY CONTROL CHARACTERISTICS - PART 6-6: GRAPHENE - UNIFORMITY OF STRAIN IN GRAPHENE ANALYZED BY RAMAN SPECTROSCOPY |
| IEC/TC 113/PT 62607-6-9 | NANOMANUFACTURING - KEY CONTROL CHARACTERISTICS - PART 6-9: GRAPHENE - MEASUREMENT OF SHEET RESISTANCE BY THE NON-CONTACT EDDY CURRENT METHOD |
| IEC/TC 113/PT 62607-6-5 | NANOMANUFACTURING - KEY CONTROL CHARACTERISTICS - PART 6-5: GRAPHENE - SHEET RESISTANCE AND CONTACT RESISTANCE OF TWO-DIMENSIONAL MATERIALS INCLUDING GRAPHENE |
| IEC/TC 113/PT 62607-6-14 | NANOMANUFACTURING ' KEY CONTROL CHARACTERISTICS ' PART 6-14: GRAPHENE 'DEFECT LEVEL ANALYSIS IN GRAPHENE POWDER USING RAMAN SPECTROSCOPY |
| IEC/TC 113/PT 62607-6-13 | NANOMANUFACTURING ' KEY CONTROL CHARACTERISTICS ' PART 6-13: DETERMINATION OF OXYGEN FUNCTIONAL GROUPS CONTENT OF GRAPHENE MATERIALS WITH BOEHM TITRATION METHOD |
| IEC/TC 113/PT 62607-6-11 | NANOMANUFACTURING - KEY CONTROL CHARACTERISTICS - PART 6-11: GRAPHENE MATERIALS - DEFECT LEVEL OF GRAPHENE FILMS: RAMAN SPECTROSCOPY |
| IEC/TC 113/PT 62607-7-2 | NANOMANUFACTURING - KEY CONTROL CHARACTERISTICS - PART 7-2: NANO-ENABLED PHOTOVOLTAICS - DEVICE EVALUATION METHOD FOR INDOOR LIGHT |
| IEC/TC 113/PT 62607-9-1 | NANOMANUFACTURING ' KEY CONTROL CHARACTERISTICS ' PART 9-1: SPATIALLY RESOLVED MAGNETIC FIELD MEASUREMENTS ' MAGNETIC FORCE MICROSCOPY |
| IEC/TC 113/PT 62607-4-8 | NANOMANUFACTURING - KEY CONTROL CHARACTERISTICS ' PART 4-8: NANO-ENABLED ELECTRICAL ENERGY STORAGE DEVICES - DETERMINATION OF WATER CONTENT FOR ELECTRODE NANOMATERIALS BY THE KARL FISCHER METHOD |
| IEC/TC 113/PT 62607-8-2 | IEC TS 62607-8-2: NANOMANUFACTURING - KEY CONTROL CHARACTERISTICS - PART 8-2: NANO-ENABLED METAL-OXIDE INTERFACIAL DEVICES - TEST METHOD FOR THE POLARIZATION PROPERTIES BY THERMALLY STIMULATED DEPOLAR |
| IEC/TC 113/AHG 13 | WAFER-SCALE SYSTEM INTEGRATION |
