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IEC/TC 47/SC 47D | BOîTIERS DES DISPOSITIFS SEMI-CONDUCTEURS |
IEC/TC 47/SC 47E | DISPOSITIFS DISCRETS Ã SEMICONDUCTEURS |
IEC/TC 47/SC 47F | SYSTèMES MICROéLECTROMéCANIQUES |
IEC/TC 47/SC 47E/WG 4 | OPTOCOUPLEURS, PHOTOCOUPLEURS ET OPTORELAIS à éTAT SOLIDE |
IEC/TC 47/SC 47E/WG 1 | CAPTEURS Ã SEMICONDUCTEURS |
IEC/TC 47/SC 47F/WG 2 | CHARACTERIZATIONS AND TESTING METHODS OF MATERIALS AND STRUCTURES FOR MICROELECTROMECHANICAL SYSTEMS |
IEC/TC 47/WG 2 | SEMICONDUCTOR DEVICE TEST METHODS AND GUIDELINES - MECHANICAL, CLIMATIC AND STORAGE |
IEC/TC 47/WG 6 | INCUBATING WORKING GROUP |
IEC/TC 47/SC 47F/WG 3 | MICRO-ELECTROMECHANICAL DEVICES AND PACKAGING |
IEC/TC 47/SC 47E/WG 2 | MICROWAVE DEVICES |
IEC/TC 47/SC 47D/WG 1 | PACKAGE OUTLINES |
IEC/TC 47/SC 47E/WG 3 | POWER DEVICES |
IEC/TC 47/WG 7 | SEMICONDUCTOR DEVICES FOR ENERGY CONVERSION AND TRANSFER |
IEC/TC 47/SC 47F/WG 1 | TERMINOLOGIES AND GENERIC SPECIFICATION FOR MICRO-ELECTROMECHANICAL SYSTEMS |
IEC/TC 47/WG 1 | TERMINOLOGY |
IEC/TC 47/SC 47D/WG 2 | TERMS, DEFINITIONS, MEASURING METHODS AND RELATED REQUIREMENT FOR SEMICONDUCTOR DEVICES PACKAGING |
IEC/TC 47/WG 5 | WAFER LEVEL RELIABILITY FOR SEMICONDUCTOR DEVICES |
IEC/TC 47/SC 47F/MT 1 | MAINTENANCE TEAM FOR THE PUBLISHED ISS UNDER SC 47F/ WG 2 |
IEC/TC 47/SC 47E/PT 60747-14-11 | SEMICONDUCTOR DEVICES Â PART 14-11: SEMICONDUCTOR SENSORS Â TEST METHOD OF SURFACE ACOUSTIC WAVE BASED INTEGRATED SENSOR FOR MEASURING ULTRA VIOLET, ILLUMINATION AND TEMPERATURE |
IEC/TC 47 | DISPOSITIFS Ã SEMICONDUCTEURS |
IEC/TC 47/PT 63492 | SEMICONDUCTOR DEVICES - ISOLATION FOR SEMICONDUCTOR DEVICES - PART 1: FAILURE MECHANISMS AND MEASUREMENT METHODS TO EVALUATE SOLID INSULATION FOR SEMICONDUCTOR DEVICES |
CLC/TC 47X | SEMICONDUCTORS AND TRUSTED CHIPS IMPLEMENTATION |
Expert | Organisme d'appartenance | Organisme représenté |
---|---|---|
M. GUIOT | SOITEC | ACSIEL |
MME. CHETALI | HUAWEI TECHNOLOGIES FRANCE | HUAWEI TECHNOLOGIES FRANCE |
M. DANNO | HUAWEI TECHNOLOGIES FRANCE | HUAWEI TECHNOLOGIES FRANCE |
MME. PAVLOVA | INFINEON TECHNOLOGIES FRANCE | INFINEON TECHNOLOGIES FRANCE |
M. CHERGUI | INTERNET OF TRUST | INTERNET OF TRUST |
MME. LAVATELLI | INTERNET OF TRUST | INTERNET OF TRUST |
M. DEMOULIN | MICROCHIP TECHNOLOGY ROUSSET | MICROCHIP TECHNOLOGY ROUSSET |
M. ZETTEL | MICROCHIP TECHNOLOGY ROUSSET | MICROCHIP TECHNOLOGY ROUSSET |
M. LEPAPE | NANOXPLORE | NANOXPLORE |
M. ABOUDA | NXP SEMICONDUCTORS FRANCE | NXP SEMICONDUCTORS FRANCE SAS |
MME. ATALLAH | NXP SEMICONDUCTORS FRANCE | NXP SEMICONDUCTORS FRANCE SAS |
M. GUILLEY | SECURE-IC SAS | SECURE-IC SAS |
M. SHRIVASTWA | SECURE-IC SAS RPP 13450677 | SECURE-IC SAS |
M. ABATE | ST MICROELECTRONICS | STMICROELECTRONICS (GRENOBLE 2) SAS |
M. CHEENNE | STMICROELECTRONICS (GRENOBLE 2) SAS | STMICROELECTRONICS (GRENOBLE 2) SAS |
MME. COMPANS | STMICROELECTRONICS ROUSSET SAS | STMICROELECTRONICS (GRENOBLE 2) SAS |
M. COURCAMBECK | STMICROELECTRONICS (GRENOBLE 2) SAS | STMICROELECTRONICS (GRENOBLE 2) SAS |
M. DI RUSSO | ST MICROELECTRONICS | STMICROELECTRONICS (GRENOBLE 2) SAS |
M. FEIX | ST MICROELECTRONICS | STMICROELECTRONICS (GRENOBLE 2) SAS |
M. FONBONNE | ST MICROELECTRONICS | STMICROELECTRONICS (GRENOBLE 2) SAS |
M. MAS | STMICROELECTRONICS (GRENOBLE 2) SAS | STMICROELECTRONICS (GRENOBLE 2) SAS |
Expert | Organisme d'appartenance | Organisme représenté |
---|---|---|
M. JOUANOLLE | DGA - DT/IP/MCM/PCO | DGA - DT/IP/MCM/PCO |
Expert | Organisme d'appartenance | Organisme représenté |
---|---|---|
M. GUILLOY | EDF | EDF |
Expert | Organisme d'appartenance | Organisme représenté |
---|---|---|
M. WYON | CEA | CEA |
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